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| 10Base-T Interface Module ELECTRONICS INC. EPA2013D & EPA2013D-RC * General Purpose 10Base-T Filter Module * Complies with or exceeds IEEE 802.3, 10Base-T Standards * Add "-RC" after part number for RoHS Compliant * Available in SMD and DIP Packages Electrical Parameters @ 25 C Cut-Off Frequency (MHz) 1.0 MHz Xmit/Rcv 17/17 Insertion Loss (dB Max.) 1-10 MHz Xmit/Rcv -1/-1 * Return Loss (dB Min.) 5-10 MHz Xmit/Rcv -15/-15 @ 20 MHz Xmit/Rcv -7/-6 Attenuation (dB Min.) @ 25 MHz Xmit/Rcv -19/-14 @ 30 MHz Xmit/Rcv -30/-20 @ 40 MHz Xmit/Rcv -35/-31 Common Mode Rejection (dB Min.) @ 50 MHz Xmit -30 @ 100 MHz Xmit -25 Crosstalk (dB Min.) 1-10 MHz Xmit/Rcv -30/-30 Isolation : meets or exceeds 802.3 IEEE Requirements * Characteristic Filter Impedance : 100 * * Referenced to the Output Level Fundamental Frequency @ 5 MHz * CMC is common to both channels * Package .990 (25.15) .145 (3.68) PCA EPA2013D(-RC) Date Code Schematic Component Outline .390 x .990 (10.13 x 25.15) .300 (7.62) Transmit Channel 1 2 .325 (8.26) .034 O (.864) Drill .060 O (1.52) Solder Pad 6 LPF 8 .008/.012 (.203/.305) 7 1:1 3 LPF 1:1 16 15 14 Pin 1 I.D. .270 (6.86) Suggested PCB Layout .700 (17.78) .700 (17.78) .125/.150 (3.18/3.81) .020/.030 (.508/.762) Receive Channel 11 10 9 .300 (7.62) .018/.022 (.457/.599) .300 (7.62) .100 (2.54) .310/.375 (7.87/9.53) Notes : 1. Lead Finish 2. Peak Temperature Rating (Wave Solder Process Only) (per IPC/JEDEC-J-STD-020C) EPA2013D SnPb 225C 2.8 grams (Tube) 19 pieces/tube EPA2013D-RC Hot Tin Dip (Sn) 260C 10 (+2/-0) seconds 2.8 grams 19 pieces/tube 3. Weight 4. Packaging Information Lead Material : Matte Tin with Ni Barrier Unless Otherwise Specified Dimensions are in Inches /mm .010 /.25 PCA ELECTRONICS, INC. 16799 SCHOENBORN ST. NORTH HILLS, CA 91343 Product performance is limited to specified parameters. Data is subject to change without prior notice. CSA2013D & --RC Rev. G2 9/20/06 JDG TEL: (818) 892-0761 FAX: (818) 894-5791 http://www.pca.com |
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